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ISSUANCE OF デュエルビッツ 初回入金ボーナスN BONDS
April 21, 2009
I. デュエルビッツ 初回入金ボーナスn Bonds due 25 April 2014
1. | Name: | デュエルビッツ 初回入金ボーナスel, Ltd. Series 53 Unsecured Bonds (Limited Inter-Bond Pari Passu Clause) |
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2. | Total Amount of Issue: | 16 Billion Yen | |
3. | Denomination of Bond: | 100,000,000 Yen each | |
4. | Interest Rate: | 1.77% per annum of the principal of the Bonds | |
5. | Issue Price: | 100% of the principal amount of the Bonds | |
6. | Redemption Price: | 100% of the principal amount of the Bonds | |
7. | Maturity Date: | To be redeemed in a lump sum on 25 April 2014 | |
8. | Offering Period: | 21 April 2009 | |
9. | Closing Date: | 27 April 2009 | |
10. | Method of Issue: | Public offering in the domestic market | |
11. | Date of Payment of Interest on the Bonds: | Semiannually on 27 April and 27 October | |
12. | Status of the Bonds: | Unsecured by assets or guarantees | |
13. | Fiscal Agent: | Mizuho Corporate Bank, Ltd. | |
14. | Underwriters: | Nomura Securities Co., Ltd. |
Use of Proceeds: To be applied mainly toward the redemption of bonds and also repayment of loans
II. デュエルビッツ 初回入金ボーナスn Bonds due 26 April 2019
1. Name: | デュエルビッツ 初回入金ボーナスel, Ltd. Series 54 Unsecured Bonds (Limited Inter-Bond Pari Passu Clause) |
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2. Total Amount of Issue: | 7 Billion Yen | |
3. Denomination of Bond: | 100,000,000 Yen each | |
4. Interest Rate: | 2.50% per annum of the principal of the Bonds | |
5. Issue Price: | 100% of the principal amount of the Bonds | |
6. Redemption Price: | 100% of the principal amount of the Bonds | |
7. Maturity Date: | To be redeemed in a lump sum on 26 April 2019 | |
8. Offering Period: | 21 April 2009 | |
9. Closing Date: | 27 April 2009 | |
10. Method of Issue: | Public offering in the domestic market | |
11. Date of Payment ofInterest on the Bonds: | Semiannually on 27 April and 27 October | |
12. Status of the Bonds: | Unsecured by assets or guarantees | |
13. Fiscal Agent: | Sumitomo Mitsui Banking Corporation | |
14. Underwriters: | Nomura Securities Co., Ltd. |
Use of Proceeds: To be applied mainly toward the redemption of bonds and also repayment of loans