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デュエルビッツ 初回入金ボーナス

ISSUANCE OF デュエルビッツ 初回入金ボーナスN BONDS

April 21, 2009

デュエルビッツ 初回入金ボーナスel, Ltd. hereby gives notice that it has decided to issue Domestic Unsecured Yen Bonds under the terms as set forth below:

I. デュエルビッツ 初回入金ボーナスn Bonds due 25 April 2014

1. Name: デュエルビッツ 初回入金ボーナスel, Ltd.
Series 53 Unsecured Bonds
(Limited Inter-Bond Pari Passu Clause)
2. Total Amount of Issue: 16 Billion Yen
3. Denomination of Bond: 100,000,000 Yen each
4. Interest Rate: 1.77% per annum of the principal of the Bonds
5. Issue Price: 100% of the principal amount of the Bonds
6. Redemption Price: 100% of the principal amount of the Bonds
7. Maturity Date: To be redeemed in a lump sum on 25 April 2014
8. Offering Period: 21 April 2009
9. Closing Date: 27 April 2009
10. Method of Issue: Public offering in the domestic market
11. Date of Payment of Interest on the Bonds: Semiannually on 27 April and 27 October
12. Status of the Bonds: Unsecured by assets or guarantees
13. Fiscal Agent: Mizuho Corporate Bank, Ltd.
14. Underwriters: Nomura Securities Co., Ltd.

Use of Proceeds: To be applied mainly toward the redemption of bonds and also repayment of loans


II. デュエルビッツ 初回入金ボーナスn Bonds due 26 April 2019

1. Name: デュエルビッツ 初回入金ボーナスel, Ltd.
Series 54 Unsecured Bonds
(Limited Inter-Bond Pari Passu Clause)
2. Total Amount of Issue: 7 Billion Yen
3. Denomination of Bond: 100,000,000 Yen each
4. Interest Rate: 2.50% per annum of the principal of the Bonds
5. Issue Price: 100% of the principal amount of the Bonds
6. Redemption Price: 100% of the principal amount of the Bonds
7. Maturity Date: To be redeemed in a lump sum on 26 April 2019
8. Offering Period: 21 April 2009
9. Closing Date: 27 April 2009
10. Method of Issue: Public offering in the domestic market
11. Date of Payment ofInterest on the Bonds: Semiannually on 27 April and 27 October
12. Status of the Bonds: Unsecured by assets or guarantees
13. Fiscal Agent: Sumitomo Mitsui Banking Corporation
14. Underwriters: Nomura Securities Co., Ltd.

Use of Proceeds: To be applied mainly toward the redemption of bonds and also repayment of loans