Home>デュエルビッツ 入金不要ボーナス>2011 > ISSUANCE OF デュエルビッツ ボーナスEN BONDS

Press Releases

The information on this Web site is presented "as is." Product availability, organization, and other content may differ from the time the information was originally posted. Changes may take place without notice.

  • デュエルビッツ ボーナス
  • デュエルビッツ ボーナス
  • Email
  • print

デュエルビッツ ボーナス

ISSUANCE OF デュエルビッツ ボーナスEN BONDS

November 18, 2011

デュエルビッツ ボーナスel, Ltd. hereby gives notice that it has decided to issue Domestic Unsecured Yen Bonds under the terms as set forth below:

デュエルビッツ ボーナスen Bonds due 25 November 2021

1. Name: デュエルビッツ ボーナスel, Ltd.
Series 55 Unsecured Bonds
(Limited Inter-Bond Pari Passu Clause)
2. Total Amount of Issue: 10 Billion Yen
3. Denomination of Bond: 100,000,000 Yen each
4. Interest Rate: 1.217% per annum of the principal of the Bonds
5. Issue Price: 100% of the principal amount of the Bonds
6. Redemption Price: 100% of the principal amount of the Bonds
7. Maturity Date: To be redeemed in a lump sum on 25 November 2021
8. Offering Period: 18 November 2011
9. Closing Date: 25 November 2011
10. Method of Issue: Public offering in the domestic market
11. Date of Payment of
Interest on the Bonds:		 Semiannually on 25 November and 25 May
12. Status of the Bonds: Unsecured by assets or guarantees
13. Fiscal Agent: The Bank of Tokyo-Mitsubishi UFJ, Ltd.
14. Underwriters: Nomura Securities Co., Ltd.
Mitsubishi UFJ Morgan Stanley Securities Co., Ltd.
as the "Joint Lead Managers"
Use of Proceeds: To be applied mainly toward the redemption of bonds

Site Map　|　Handling of Privacy & Personal Information　|　Disclaimer (About © デュエルビッツ ボーナスEL, LTD. 1995-2024